切片缺点模式说明

切片缺點模式說明切片缺點模式說明Cross-section Defect Mode內容介紹內容介紹(CONTENT)1.通孔(Through via)1.1.熱應力前(Before thermal stress test)1.1.1.孔銅厚度/穿孔力(Copper thickness/Throwing power)1.1.2.鍍銅斷裂(Plating crack)1.1.3.孔破(Plating void)1.1.4.壓合空泡(Air bubble)1.1.5.燈蕊效應(Wicking)1.1.6.回蝕(Etch back)1.1.7.反回蝕(Negative etch back)1.1.8.釘頭(Nail Head)1.1.9.ICD-膠渣(Smear)1.1.10.ICD-內層銅分離(Inner layer connection separation)1.1.11.孔壁粗糙度(Hole wall roughness)內容介紹內容介紹(CONTENT)1.2.熱應力後(After thermal stress test)1.2.1.孔壁浮離(Pull away)1.2.2.樹脂內縮(Resin recession)1.2.3.內層連接不良(Innerlayer Connection Defect)1.2.4.鍍銅斷裂(Crack)2.盲孔(Blind via)2.1.一般盲孔2.1.1.銅厚(Copper thickness)2.1.2.碗型孔(Barrel Shaped)2.1.3.蟹腳(Crab feet)2.1.4.雷射膠渣(Laser smear)2.1.5.跳鍍(Step plating)2.1.6.孔破(bubble void)2.2.電鍍填孔(Fill via by plating)2.2.1.填孔凹陷(Dimple)2.2.2.空泡(Air bubble)內容介紹內容介紹(CONTENT)3.外觀檢查(Visual inspection):3.1.背光(Back Light)3.2.板面燒焦(Burning)3.3.電鍍顆粒(Copper Nodule)3.4.鍍銅均勻性(Uniformity)3.5.凹陷(Pin&Dent)3.6.刮傷(Scrab)3.7.板面粗糙(Panel roughness)3.7.板面氧化(Surface Oxide)1.1.1.a 孔銅銅厚：孔銅銅厚：Hole copper thicknessCriteria:Min.0.8 Mil()1234561量測孔徑，以確保切片準確性1.1.1.b 面銅銅厚：面銅銅厚：Surface copper thickness791081.1.1.c 穿孔力：穿孔力：Throwing Power 通孔銅厚之通孔銅厚之最小值最小值 面銅面銅平均值平均值(不含基材銅不含基材銅)穿孔力穿孔力=Throwing Power=Minimum of hole copper thicknessAverage of surface copper thicknessSpecification:P.P thickness75Mil T/P=75%()1.1.1.c 穿孔力：穿孔力：Through Power1.1.2.鍍銅斷裂：鍍銅斷裂：Plating crackCriteria:Not Allowed Crack1.1.3.孔破：孔破：Plating voidCriteria:Not AllowedNG1.1.4.壓合空泡：壓合空泡：Air bubbleCriteria:Not Allowed1.1.5.燈蕊效應燈蕊效應 (Wicking)AcceptRejectSpec.:3 mil1.1.6.回蝕回蝕(Etch back)RejectSpec.:3 milAccept1.1.7.反回蝕反回蝕(Negative etch back)AcceptRejectSpec.:1 mil1.1.8.釘頭釘頭(Nail Head)AcceptRejectABSpec.:B/A 1.7 for 1 oz B/A 2.0 for 0.5 oz1.1.9.ICD-膠渣膠渣(Smear)膠渣造成ICD(Smear causes ICD)Not Allowed1.1.10.ICD-內層銅分離內層銅分離(Inner plane separation)RejectReject1.1.11.孔壁粗糙度孔壁粗糙度(Hole wall roughness)Spec.:1.4 mil1.2.1.1.2.1.孔壁浮離孔壁浮離 (Pull Away)Pull Away)RejectSpec.:浮離部份之長度板厚20 1.2.2.1.2.2.樹脂內縮樹脂內縮 (Resin recession)Resin recession)(after T/S test)(after T/S test)Spec.:Width:Max.3 milNo longer 20%of cumulative base material thickness.Spec.:最大：3.0MIL，且內縮部份之長度板厚20 1.2.2.樹脂內縮計算方式樹脂內縮計算方式(Resin recession measuring)單位(mil)孔壁長67.24樹脂內縮3.242.35.54比例計算:5.54/67.24=8.23%20%(PASS)1.2.3.1.2.3.內層連接不良內層連接不良 (ICD)ICD)(after T/S test)(after T/S test)RejectReject1.2.4.1.2.4.鍍銅斷裂鍍銅斷裂 (Crack)Crack)(after T/S test)(after T/S test)RejectRejectWorld Class QualityCONFIDENTIALUnimicron242.1.1.銅厚銅厚(Copper thickness)2.1.2.碗型孔碗型孔(Barrel shaped)BAB/A 1.162.1.3.蟹腳蟹腳(Under cut)Under CutMax.10 umSpec.:8級。